Dr. Amy Fleischer
Current Master's Degree Students:
Srikanth Challa: “Influence of Thermal Wakes on Heat Generating Devices Operating in Mixed Convection in Close Proximity on a Printed Circuit Board."
Kireeti Chintakrinda: "An Investigation into the Application of Conductivity-Enhanced Phase Change Materials for Transient Thermal Management."
Ravi Yakkatelli: "Analytical and Experimental Study of Stagnation Point Flow in Porous Media."
Sinduhuireddy Sreepati: "A Numerical Model of Phase Change Materials for Transient Thermal Management."
Current Undergraduate Students:
Patrick McGrath: "Flow Mechanics of an Air Jet Impinging on a Pedestal."
Alumni Graduate Students:
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2007:
Venugopal Gandikota: "Determination of Heat Removal Rate from Advanced Heat Sinks in Two-Phase Flow," currently with Vanguard Group.
Patrick Kirby: Thermal Interactions in Free Convection from Two Unequally Powered Discrete Heat Sources on a Vertical Printed Circuit Board."
2006:
Harish Chengalvala, MSME, “Evaluation of a Carbon-Fiber Brush Heat Sink in Two-Phase Boiling Flow,” currently with Dade Behring.
Brian Comber, MSME, “Thermal Proximity Effects of Packaged RF High Power Amplifier Discretes,” currently with Orbital Sciences Corporation.
2005:
Sharareh R. Nejad, MSME, “Jet Impingement Cooling of Heated Plates and Raised Pedestals Representing Microchip Arrangements,” currently with Schoor DePalma Engineers and Consultants.
Jared Harvest, MSME “Effects of Proximity on Overheating of Adjacent Devices on Printed Circuit Boards,” currently with Fluent, Inc. as IcePak Support Engineer.
Thomas Kopec, MSChE, “Phase Change Materials With Carbon Nanofibers For Thermal Management Of Electronics,” currently with Integra LifeSciences as a Product Development Associate Engineer.
Alumni Undergraduate Students:
•John Duda: "Flow Mechanics of an Air Jet Impinging on a Pedestal."
Francis Lagor, class of 2006, “Flow Mechanics of an Air Jet Impinging on a Pedestal,” currently Ph.D. student at the University of Pennsylvania.
Michael Nyhan, class of 2005, “Mitigation and Detection of Thermal Signatures of Unmanned Surface Vehicles,” currently with Fluor Corportation as a Process Engineer.
Brian Comber, class of 2005, “Thermal Proximity Effects of Packaged RF High Power Amplifier Discretes,” (also became a graduate student - see above) currently with Orbital Sciences Corporation.
Matthew Voorhees, class of 2005, “Use of Infrared Thermography in Thermal Management of Electronics,” currently with Enercon Services.
Kerry Kamon, class of 2005, “Use of Infrared Thermography in Thermal Management of Electronics,” currently with Lockheed Martin and a graduate student pursuing a MSEE at the University of Pennsylvania.
Adrienne Darr, class of 2004, “Experimental Investigation of Phase Change Materials for Thermal Management of Naval Electronics,” currently with Naval Surface Warfare Center, Carderock Division.
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Anthony Reindl, class of 2004, “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” currently with L3 Communications Electronics Division.
Christina Turka, class of 2003, “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” received MSME from University of Delaware, 2005, currently with Rohm and Haas Electronic Materials Division.
•Craig Iwano, class of 2003, “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” currently with Materials, Research and Design, Inc.
•Jared Harvest, class of 2003, “Natural Convection from Two Heat Sources Maintained at Different Temperatures on Multiple Printed Circuit Boards,” (also became a graduate student - see above) currently with Fluent, Inc. as IcePak Support Engineer.
Kimberly (Krug) Fogarty, class of 2002, “Natural Convection from Two Heat Sources Maintained at Different Temperatures on a Single Printed Circuit Board,” currently with BASF.
•Thomas Kopec, class of 2002, “Natural Convection from Two Heat Sources Maintained at Different Temperatures on a Single Printed Circuit Board,” (also became a graduate student - see above) currently with Integra LifeSciences as a Product Development Associate Engineer.•
