Dr. Amy Fleischer
Dr. Amy Fleischer is an Associate Professor in the Department of Mechanical Engineering at Villanova University, and Director of the Villanova Thermal Management Lab (NovaTherm). She is currently also serving as the Vice-Chair of the ASME International Technical Committee on Electronics Cooling (HTD-K16).
During 2003, she spent a term in Berlin as a visiting scientist in the
Advanced Systems Engineering Department of the Reliability and Microintegration Division (IZM) of the Fraunhofer Institute.
Education
1996 M
ME, Villanova University1991 BME, Villanova University
Research Interests
Thermal management of advanced electronics including wireless systems, portable electronics, and high-performance industrial, consumer and military electronics. Thermal issues in electronics packaging. Fluid dynamics of impinging jets. Flow visualization techniques. Micro-scale thermal transport.
Dr. Fleischer has received numerous research grant awards, from such agencies as the National Science Foundation and the Office of Naval Research. A list of her publications and research activity is available by using the research link at left.
Selected Professional Activities
Vice-Chair
The ASME K-16 Committee is a joint committee of the Heat Transfer Division (HTD) and the Electrical and Electronic Packaging Division (EEPD). It is the focal point for ASME activities in the area of Thermal Management of Electronics. The committee strives to provide leadership in the dissemination of technical information, the transfer of technology, and the interchange of ideas between industrial, academic and government institutions involved in the science and the pedagogy of heat transfer and thermal management in electronics packaging.
Conference Co-Chair, Thermal Challenges Of Next Generation Electronic Systems (Thermes) II: 2007, held Jan 7-10, 2007, Santa Fe, NM, USA.
This unique conference provided a forum for the exchange of ideas, results and industrial needs in thermal phenomena related to electronics cooling. The two keynote lectures featured Raj Yavaktar (Intel fellow) and Shiego Kubota (Senior Vice President and Corporate Executive President, Sony Corporation) who both spoke at length on the thermal challenges facing their companies. Four invited talks in selected emerging areas from leading experts in industry (H. Hosack, SRC; S. Yi, Samsung; M. Mochizuki, Fujikura; B. Sen, Sun Microsystems) were complemented with 37 contributed papers organized into eight technical sessions. A conference highlight was the eight panel discussions focused on technology and market trends and identification of research challenges. Each panel featured both industrial and academic panelists. All keynote, invited and contributed papers were published in a 428 page book and CD-ROM which was distributed to all participants, and is also separately available from the publisher: THERMES 2007: Thermal Challenges in Next Generation Electronic Systems, Proceedings of THERMES 2007 conference, Santa Fe, New Mexico, January 7-10, 2007, Suresh V. Garimella and Amy S. Fleischer, Eds., Millpress, Netherlands, 2007.
ASME Heat Transfer Division Conference Organizing Committee and Thermal Track Leader, Track 10 - Electronics Cooling – 2005 American Society of Mechanical Engineers Summer Heat Transfer Conference, San Francisco, July 17-22, 2005.
Copyright 2007 Villanova University Department of Mechanical Engineering
Last updated 5/5/07 ASF